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By Asia Education Review Team , Tuesday, 30 April 2024 10:34:06 AM

Malaysia-China Vow Joint Research in Science, Tech, and Innovation

  • Malaysia and China have reaffirmed their commitment to collaborative research endeavors through the Second Malaysia-China Joint Research Project Group. This collaboration primarily targets critical domains such as energy storage technology and human vaccines. The scope of collaboration also extends to encompass space technology, artificial intelligence, blockchain, and advanced materials technology.

    The Science, Technology, and Innovation Ministry (Mosti) released a statement indicating that discussions on these matters took place during the 3rd Malaysia-China Joint Committee Meeting (JCM) on Science, Technology, and Innovation (STI) Cooperation. The meeting, co-chaired by Science, Technology, and Innovation Minister Chang Lih and his Chinese counterpart Yin Hejun, formed part of Chang’s official visit to China.

    The 3rd JCM builds upon the STI Cooperation Agreement signed by Malaysia and China on October 4, 2013, marking a significant milestone in their bilateral relations, coinciding with the 50th anniversary of Malaysia-China diplomatic ties. 

    Various areas of cooperation were highlighted during the meeting, including microelectronics technology, advanced materials technology, technology transfer, entrepreneurship, people-to-people exchange, and collaboration within multilateral frameworks.

    The statement from Mosti also mentioned the signing of a Memorandum of Understanding (MoU) between Xiamen University, the Malaysian Institute of Microelectronic Systems (MIMOS), and Xiamen University Malaysia, focusing on semiconductor and microelectronics technology cooperation.

    Chang's visit also involved exploring potential collaborations with STI industries in China, including China Electronics Technology Group Corporation (CETC), TCab Technology Co. Ltd., and Xiaomi. Notably, a significant MoU was signed between MIMOS Berhad and CETC at CETC's premises, reflecting a joint commitment to innovation in key sectors such as advanced packaging, broadband semiconductors, and system design.

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